Shenzhen YGY Tempered Glass Co.,Ltd.

Shenzhen YGY Tempered Glass Co.,Ltd.

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3D Printer Multi-Layer Rigid PCB / 6 Layer Metal Core Printed Circuit Board Design

3D Printer Multi-Layer Rigid PCB / 6 Layer Metal Core Printed Circuit Board Design

    • 3D Printer Multi-Layer Rigid PCB / 6 Layer Metal Core Printed Circuit Board Design
    • 3D Printer Multi-Layer Rigid PCB / 6 Layer Metal Core Printed Circuit Board Design
  • 3D Printer Multi-Layer Rigid PCB / 6 Layer Metal Core Printed Circuit Board Design

    Product Details:

    Place of Origin: China
    Brand Name: XCE
    Certification: CE,FCC,Rohs,ISO9001,SGS,UL
    Model Number: XCER

    Payment & Shipping Terms:

    Minimum Order Quantity: 1PCS
    Price: USD 1-500
    Packaging Details: inner vacuum package, outer carton box
    Payment Terms: Western Union, L/C, T/T
    Supply Ability: 10000000pcs / per month
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    Detailed Product Description
    Layer: 6 Board Size: 17*6cm
    Board THK: 1.2mm Cu THK: 35UM
    Panel: 6*1 Color: Green

    3D Printer Multi-Layer Rigid PCB Circuit Boards With Specialty Metal Core

     

     

    Quick detail:

     

    Place of Origin:Guangdong, China (Mainland)
    Brand Name: XCE
    Model Number: XCER
    Number of Layers: 6-Layer
    Base Material: FR-4
    Copper Thickness: inner layers 1oz, outer layers 1.5oz
    Board Thickness: 62mil
    Surface Finishing:  immersion gold

     

     

     

    Parameter:

     

     
    Layer No. 1-26
    Min board thickness 2 layer 0.2mm
    4 layer 0.4mm
    6 layer 0.6mm
    8 layer 0.8mm
    10 layer 1.0mm
    Max panel size 508*610mm
    Board thickness tolerance   T≥0.8mm±8%,T<0.8mm±5%
    Wall hole copper thickness   >0.025mm(1mil)
    Finished hole 0.2mm-6.3mm
    Min line width 4mil/4mil(0.1/0.1mm)
    Min bonding pad space 0.1mm(4mil)
    PTH aperture tolerance ±0.075mm(3mil)

     

     

    PCB Capabilities By Market:

     

    1.

    High Reliability PC Boards

     

    -Up to 2000 Thermal cycles

     

     

     

    2.

    Burn-in Boards

     

    -6 Layers - .042" thick

     

    -.5 mm pitch

     

    -Step-down connectors

     

    -Special materials

     

    -Large sizes up to 24" x 28"

     

    -High Reliability

     

    3.

    High Technology Boards

     

    -Microelectronics (Line and Space down to .00125"/.00125") 

     

    -Differential Impedance

     

    -Up to 30 Layers

     

    -Lead Free process

     

    -Special materials

     

    -Sequential lamination

     

    -Blind and buried vias

     

    -Laser Drill

     

    -Filled vias

     

    -Via in pads

     

    -Milspec

     

     

    Contact Details
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